au.\*:("Société française du vide. comité couches minces, matériaux et technologie pour l'électronique")
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8e Colloque international sur les procédés plasma, 10-14 juin 1991, Antibes-Juan-Les-Pins, FranceLe Vide, les couches minces. 1991, Vol 47, Num 256, issn 0223-4335, SUPConference Proceedings
Transmetteur de mesure de pression partielle 600 A = Partial pressure measure transmitterMARTIN, B.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 390-392, issn 0223-4335, SUPConference Paper
Assistance ionique : RF, Kaufman, ECR ou gridless = Ionic assistance: RF, Kaufman, ECR or gridlessLe Vide, les couches minces. 1991, Vol 47, Num 256, pp 404-405, issn 0223-4335, SUPConference Paper
New hard coatings grown from physical vapor deposition techniques : properties and industrial applicationsCOLL, B. F.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 155-170, issn 0223-4335, SUPConference Paper
Dispositif de chauffage des substrats dans les installations de dépôts sous vide = Device for substrate heating in vacuum deposition installationsJACQUES, F.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 398-400, issn 0223-4335, SUPConference Paper
Perspectives en gravure sèche des nouveaux réacteurs plasma : applications à la microélectronique = Future prospects in dry etching of new plasma reactorsPECCOUD, L.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 76-84, issn 0223-4335, SUPConference Paper
Microelectronics detox systemsPROUST, N.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 65-72, issn 0223-4335, SUPConference Paper
L'épitaxie et la passivation des composés III - V, Plestin-les-Grèves, 24-26 avril 1990 = Epitaxy and passivation of III-V compounds, Plestin-les-Grèves, 24-26 April 1990Le Vide, les couches minces. 1990, Vol 45, Num 251, issn 0223-4335, 97 p.Conference Proceedings
Dry-etching monitoring of III-V heterostructures using laser reflectometry and optical emission spectroscopyCOLLOT, P; DIALLO, T.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 368-370, issn 0223-4335, SUPConference Paper
Numerical simulation of the effect of ion beam assistance on the structure and properties on thin C filmsANDRE, B; ROSSI, F.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 35-37, issn 0223-4335, SUPConference Paper
Electron energy spectra at a negatively biased electrode in a sputtering dischargeJOUAN, P. Y; LEMPERIERE, G.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 271-273, issn 0223-4335, SUPConference Paper
Growth conditions, structure and properties of amorphous hydrogenated carbon films prepared by ion platingBEWILOGUA, K; RAU, B.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 216-222, issn 0223-4335, SUPConference Paper
Plasma deposition of SiO2 from TEOS and mixtures of TEOS with O2 and rare gasesGARCIA, P; CATHERINE, Y.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 201-203, issn 0223-4335, SUPConference Paper
Water vapour permeability and structure of plasma polymerized ethyleneTAKAHASHI, N; PELISSIER, V.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 356-358, issn 0223-4335, SUPConference Paper
A comparative study of the cleaning of silicon surface by hydrogen and argon plasmasRAYNAUD, P; POMOT, C.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 140-142, issn 0223-4335, SUPConference Paper
Auger analysis of plasma etched narow and deep trenchesSAGNOL, PH; HALLALI, P. E.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 289-291, issn 0223-4335, SUPConference Paper
Dc magnetron sputtering of large area ITO electrodes for high quality displaysLATZ, R; SCHERER, M.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 213-215, issn 0223-4335, SUPConference Paper
Plasma processes : special valves for CVD and etchingSELE, G; BOISSIN, S.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 401-403, issn 0223-4335, SUPConference Paper
Elaboration de couches minces oxycarbure de silicium par plasma microonde = Elaboration of silicium carbide oxide thin films by microwave plasmaBERNARD, J; FRIQUET, O.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 341-343, issn 0223-4335, SUPConference Paper
Numerical simulation of plasma etching : the role of surface diffusion in two-dimensional effectsGERODOLLE, A; PELLETIER, J.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 44-46, issn 0223-4335, SUPConference Paper
Oxygen and fluorine atom surface recombination kinetics determined by time resolved actinometry in ECR plasmasBOOTH, J. P; SADEGHI, N.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 9-11, issn 0223-4335, SUPConference Paper
Diélectriques intermétalliques planarisants déposés par plasma RCE réparti = Planarizing intermetallic dielectrics deposited by DECR plasmaTISSIER, A; KHALLAAYOUNE, J.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 207-209, issn 0223-4335, SUPConference Paper
Nettoyage de surface de silicium par un plasma en postdécharge = Surface cleaning of silicon by a plasma in afterglowCHARLET, B; PECCOUD, L.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 143-145, issn 0223-4335, SUPConference Paper
Synthèse du nitrure de bore par faisceau d'ions à partir de borazine = Boron nitride synthesis by ion beam from borazineBOUCHIER, D; STAMBOULI, V.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 332-334, issn 0223-4335, SUPConference Paper
A surface wave reactor of large diameter with localized ECR effectsANDRIES, B; SAADA, S; PARRENS, P et al.Le Vide, les couches minces. 1991, Vol 47, Num 256, pp 146-148, issn 0223-4335, SUPConference Paper